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| Year of Publication |
2001
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| Journal |
Journal of Electronic Materials 30 (8), 997-1000, 2001
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Publications
Correlation between intermetallic thickness and roughness during solder reflow
Department Chair & Professor Of Mechanical Engineering (Office: BG.53)
Citation: 1.Correlation between intermetallic thickness and roughness during solder reflow. Journal of Electronic Materials 30 (8), 997-1000, 2001. 2001.
In: Journal of Electronic Materials 30 (8), 997-1000, 2001
Published by: AS Zuruzi, SK Lahiri, P Burman, KS Siow , 2001
google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…
Cited by: 15