Year of Publication
2001
Journal
Journal of Electronic Materials 30 (8), 997-1000, 2001

Correlation between intermetallic thickness and roughness during solder reflow

11-07-2022

Prof. Zuruzi Abu Samah

Department Chair & Professor Of Mechanical Engineering (Office: BG.53)

Citation: Correlation between intermetallic thickness and roughness during solder reflow. Journal of Electronic Materials 30 (8), 997-1000, 2001. 2001.

In: Journal of Electronic Materials 30 (8), 997-1000, 2001

Published by: AS Zuruzi, SK Lahiri, P Burman, KS Siow , 2001

google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…

Cited by: 15