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| Year of Publication |
1999
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| Journal |
Applied Physics Letters 75 (23), 3635-3637, 1999
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Publications
Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow
Department Chair & Professor Of Mechanical Engineering (Office: BG.53)
Citation: 1.Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow. Applied Physics Letters 75 (23), 3635-3637, 1999. 1999.
In: Applied Physics Letters 75 (23), 3635-3637, 1999
Published by: AS Zuruzi, C Chiu, WT Chen, SK Lahiri, KN Tu , 1999
google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…
Cited by: 7