Year of Publication
1999
Journal
Applied Physics Letters 75 (23), 3635-3637, 1999

Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow

07-09-2022

Prof. Zuruzi Abu Samah

Department Chair & Professor Of Mechanical Engineering (Office: BG.53)

Citation: Interdiffusion of high-Sn/high-Pb (SnPb) solders in low-temperature flip chip joints during reflow. Applied Physics Letters 75 (23), 3635-3637, 1999. 1999.

In: Applied Physics Letters 75 (23), 3635-3637, 1999

Published by: AS Zuruzi, C Chiu, WT Chen, SK Lahiri, KN Tu , 1999

google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…

Cited by: 7