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Year of Publication
1999
Journal
Journal of Electronic Materials 28 (11), 1224-1230, 1999
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Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions

Department Chair & Professor Of Mechanical Engineering (Office: BG.53)

Citation: 1.Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions. Journal of Electronic Materials 28 (11), 1224-1230, 1999. 1999.

In: Journal of Electronic Materials 28 (11), 1224-1230, 1999

Published by: AS Zuruzi, CH Chiu, SK Lahiri, KM Chua , 1999

Cited by: 10