Department Chair & Professor Of Mechanical Engineering (Office: BG.53)
Citation:
Maskless process for fabrication of ultra-fine pitch solder bumps for flip chip interconnects. J. Electron. Packag. 125 (4), 597-601, 2003. 2003.
In: J. Electron. Packag. 125 (4), 597-601, 2003
Published by: RTP Lee, AS Zuruzi, SK Lahiri , 2003