Year of Publication
2003
Journal
J. Electron. Packag. 125 (4), 597-601, 2003
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Maskless process for fabrication of ultra-fine pitch solder bumps for flip chip interconnects

Department Chair & Professor Of Mechanical Engineering (Office: BG.53)

Citation: Maskless process for fabrication of ultra-fine pitch solder bumps for flip chip interconnects. J. Electron. Packag. 125 (4), 597-601, 2003. 2003.

In: J. Electron. Packag. 125 (4), 597-601, 2003

Published by: RTP Lee, AS Zuruzi, SK Lahiri , 2003

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