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| Year of Publication |
2003
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| Journal |
J. Electron. Packag. 125 (4), 597-601, 2003
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Publications
Maskless process for fabrication of ultra-fine pitch solder bumps for flip chip interconnects
Department Chair & Professor Of Mechanical Engineering (Office: BG.53)
Citation: 1.Maskless process for fabrication of ultra-fine pitch solder bumps for flip chip interconnects. J. Electron. Packag. 125 (4), 597-601, 2003. 2003.
In: J. Electron. Packag. 125 (4), 597-601, 2003
Published by: RTP Lee, AS Zuruzi, SK Lahiri , 2003
google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…
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